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  • 2 месяца назадОпубликованоHigh Yield

How AMD is re-thinking Chiplet Design

Strix Halo Chip Deep-dive with a focus on AMD's next-gen die-to-die fan-out interconnect. How AMD is re-imagining Chiplet Design with ZEN 6. Learn more about the ROG Flow Z13: Follow me on X: Follow me on Bsky: Become a High Yield Patreon: 0:00 Intro 0:44 Strix Halo 2:21 Strix Halo Chip Deep-Dive 5:37 Next-gen ZEN 6 interconnect? 6:34 Strix Halo vs Granit Ridge 7:48 SerDes & Infinity Fabric on Package 11:14 GMI-wide & GMI-narrow 13:48 Next-gen Fan-out die-2-die / TSMC InFO-oS 21:11 Next-gen 3D V-Cache 22:05 From ZEN 2 to ZEN 6