TSMC 3DFabric™ is our comprehensive family of 3D Silicon Stacking and Advanced Packaging Technologies. It provides the ultimate flexibility in product design, brings packaging technologies to the forefront for innovation, and are critical to a product's performance, function, and cost. TSMC 3DFabric™ is comprised of our industry-leading frontend TSMC-SOIC™ 3D silicon stacking and backend 3D interconnect technologies which include CoWoS® (chip on wafer on substrate) and InFO (integrated fan-out).